The Bridging Scholarship program will award at least 20 scholarships to American students participating in study-abroad programs in Japan that begin in Spring 2013. Undergraduate students majoring in any field of study and attending any recognized exchange or independent program in Japan are eligible to apply for these scholarships.
Recipients of Bridging Scholarships will receive stipends of $2,500 or $4,000, depending on the length of their study program in Japan. The scholarships are funded by donations from U.S. corporations and foundations to the U.S.-Japan Bridging Foundation.
Spring 2013 study programs are those beginning between January and April 2013 and continuing for at least three months. Summer program participants are not eligible for Bridging Scholarships. (Applications for Fall 2013 will be accepted at a later date.)
The deadline for applications for Spring 2013 scholarships is Wednesday, Oct. 10, 2012.
Information on the scholarships and downloadable application forms are available online.
Students interested in applying may contact Dr. Geoff Hempill at geoffrey.hempill@csi.cuny.edu or 718.982.2301 for assistance with their applications. Further information can also be found in the Career and Scholarship Center in Building 1A, Room 105.
